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` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model 1P603S rev c hybrid coupler 3 db, 90 description the 1P603S is a low profile, high perf ormance 3db hybrid coupler in a new easy to use, manufacturing friendly surface mount package. it is designed for w-lan and mmds applications. the 1p603 is designed for balanced amplifiers, variable phase shifters and attenuators, lnas, signal distribution and is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance. it can be used in high power applications up to 25 watts. parts have been subjected to rigorous qualification testing and they are manufactured using materials with coefficients of thermal expansion (cte) compatible with common substrates su ch as fr4, g-10, rf-35, ro4003 and polyimide. produced with 6 of 6 rohs compliant tin immersion finish. electrical specifications ** frequency isolation insertion loss vswr ghz db min db max max:1 2.3 ? 2.7 20 0.30 1.20 amplitude balance phase balance power jc operating temp. db max degrees ave. cw watts oc/watt oc features: ? 2.3 ? 2.7 ghz. ? w-lan and mmds ? low loss ? high isolation ? 90 o quadrature ? surface mountable ? tape and reel ? available in lead-free (as illustrated) or tin- lead 0.25 3 25 30.6 -55 to +85 **specification based on performance of unit proper ly installed on anaren test board 54147-0001 with small signal applied. specifications subjec t to change without notice. refer to parameter definitions for details. mechanical outline 1p603* mechanical outline dimensions are in inches [millimeters] .053 .011 [1.35 0.27 ] pin 1 pin 4 pin 3 pin 2 .250 .010 [6.35 0.25 ] .200 .010 [5.08 0.25 ] pin 1 pin 2 pin 4 pin 3 gnd denotes array number 4x .040 .004 sq [1.01 0.10 ] 4x .020 .004 [0.51 0.10 ] .170 .004 [4.32 0.10 ] .120 .004 [3.05 0.10 ] gnd
model 1P603S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. hybrid coupler pin configuration the 1P603S has an orientation marker to denote pin 1. on ce port one has been identified the other ports are known automatically. please see the ch art below for clarification: configuration pin 1 pin 2 pin 3 pin 4 splitter input isolated -3db 90 ? -3db splitter isolated input -3db -3db 90 ? splitter -3db 90 ? -3db input isolated splitter -3db -3db 90 ? isolated input *combiner a 90 ? a isolated output *combiner a a 90 ? output isolated *combiner isolated output a 90 ? a *combiner output isolated a a 90 ? *notes: ?a? is the amplitude of the applied signals. when two quadrature signals with equal amplitudes are applied to the coupler as described in the table, they will combine at the output port. if the amplitudes are not equal, some of the applied energy will be directed to the isolated port. the actual phase, , or amplitude at a given frequency for a ll ports, can be seen in our de-embedded s- parameters, that can be downloaded at www.anaren.com . insertion loss and power derating curves
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model 1P603S rev c typical insertion loss derating curve for 1p603 -0.35 -0.3 -0.25 -0.2 -0.15 -0.1 -0.05 0 -100 -50 0 50 100 150 200 250 temperature of the part ( o c) insertion loss (db) typical insertion loss (f=2700mhz) 1p603 power derating curve 0 5 10 15 20 25 30 35 40 0 50 100 150 200 mounting interface temperature ( o c) power (watts) 85 insertion loss derating: the insertion loss, at a given frequency, of a group of couplers is measured at 25 c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 85 c and 150 c. a best-fit line for the measured data is computed and then plotted from -55 c to 150 c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. the thermal insertion loss is defined in the power handling section of the data sheet. as the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero. if mounting temperature is greater than 95 c, xinger coupler will perform reliably as long as the input power is derated to the curve above.
model 1P603S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. typical performance (-50c, 25c & 125c): 2300-2700 mhz
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model 1P603S rev c typical performance (-55c, 25c & 95c): 2300-2700 mhz
model 1P603S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = voltage minima of a standing wave return loss the impedance match of the coupler to a 50 system. return loss is an alternate means to express vswr. return loss (db)= 20log 1-vswr 1vswr + insertion loss the input power divided by the sum of the power at the two output ports. insertion loss(db)= 10log direct cpl in pp p + isolation the input power divided by the power at the isolated port. isolation(db)= 10log iso in p p phase balance the difference in phase angle between the two output ports. phase at coupled port ? phase at direct port amplitude balance the power at each output divided by the average power of the two outputs. 10log ? ? ? ? ? ? + 2 pp p direct cpl cpl and 10log ? ? ? ? ? ? + 2 pp p direct cpl direct
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model 1P603S rev c mounting in order for xinger surface mount couplers to work optimally, there must be 50 ? transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensure proper electrical performance. if either of these two conditions is not satisfied, electrical performance may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the pcb. this minimizes ground inductance and improves ground continuity. all of the xinger hybrid and directional couplers are constructed from ceramic filled ptfe composites which possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17-25 ppm/ o c. when a surface mount hybrid coupler is mounted to a printed circuit board, the prim ary concerns are; ensuring the rf pads of the device are in contact with the circuit trace of the pcb and insuring the ground plane of neither the component nor the pcb is in contact with the rf signal. mounting footprint 1p603* mounting footprint dimensions are in inches [millimeters] .174 [4.42] .124 [3.15] 4x 50 ? transmission line to ensure proper electrical and thermal performance there must be a ground plane with 100% solder conection underneath the part 4x .045 sq [1.14] 4x .024 [0.61] 4x .099 [2.51] 4x .024 [0.61] multiple plated thru holes to ground coupler mounting process the process for assembling this component is a conventional surface mount process as shown in figure 1. this process is conducive to both low and high volume usage. figure 1: surface mounting process steps storage of components: xinger products are available in either an immersion tin or tin-lead finish. commonly used storage procedures used to control oxidation should be followed for these surface mount components. the storage temperatures should be held between 15 o c and 60 o c. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/c. this coefficient minimizes solder joint stresses due to similar expansion rates of most commonly used board substrates such as rf35, ro4003, fr4, polyimide and g-10 materials. mounting to ?hard? substrates (alumina etc.) is possible depending upon operational temperature requirements. the solder surfaces of the coupler are all copper plated with either an immersion tin or tin-lead exterior finish. solder paste: all conventional solder paste formulations will work well with anaren?s xinger surface mount components. solder paste can be applied with stencils or syringe dispensers. an example of a stenciled solder paste deposit is shown in figure 2. as shown in the figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part.
model 1P603S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.106 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of today?s conventional reflow methods. a low and high temperature thermal reflow profile are shown in figures 5 and 6, respectively. manual soldering of these components can be done with conventional surface mount non-contact hot air soldering tools. board pre-heating is highly recommended for these selective hot air soldering methods. manual soldering with conventional irons should be avoided.
` available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model 1P603S rev c figure 5 ? low temperature solder reflow thermal profile figure 6 ? high temperature solder reflow thermal profile
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model 1P603S rev c packaging and ordering information parts are available in a reel and tube. packaging follows eia 481-2 for reels. parts are oriented in tape and reel as shown below. minimum order quantities are 2000 per reel and 77 per tube. see model numbers below for further ordering information. xin g er ? ta p e & reel dia g ram
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